Advanced chips require an entire manufacturing ecosystem
Lithography is critical, but it operates alongside deposition, etching, doping, metrology, testing and packaging.
Simplified manufacturing journey
| Stage | Purpose |
|---|---|
| Design | Define the architecture, logic and physical circuit layout. |
| Wafer preparation | Create an exceptionally pure and flat silicon surface. |
| Deposition | Add thin layers of conducting or insulating material. |
| Photolithography | Transfer circuit patterns using light and a reticle. |
| Etching and doping | Remove selected material and modify electrical properties. |
| Interconnection | Create metal pathways between components. |
| Wafer test and dicing | Identify working dies and separate them. |
| Packaging and final test | Protect the die, provide connections and verify operation. |
Important clarification
A fabrication plant uses many specialised systems. No single machine completes the entire chip.